Thermal System Identification (TSI): A methodology for post-silicon characterization and prediction of the transient thermal field in multicore chips

Minki Cho, William Song, Sudhakar Yalamanchili, Saibal Mukhopadhyay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

This paper presents a methodology for post-silicon thermal prediction to predict the transient thermal field a multicore package for various workload considering chip-to-chip variations in electrical and thermal properties. We use time-frequency duality to represent thermal system in frequency domain as a low-pass filter augmented with a positive feedback path for leakage-temperature interaction. This thermal system is identified through power/thermal measurements on a packaged IC and is used for post-silicon thermal prediction. The effectiveness of the proposed effort is presented considering a 64 core processor in predictive 22nm node and SPEC2006 benchmark applications.

Original languageEnglish
Title of host publication28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012
Pages118-124
Number of pages7
DOIs
Publication statusPublished - 2012
Event28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012 - San Jose, CA, United States
Duration: 2012 Mar 182012 Mar 22

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Other

Other28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012
CountryUnited States
CitySan Jose, CA
Period12/3/1812/3/22

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

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