Thermo-mechanical stresses and mechanical reliability of multilayer ceramic capacitors (MLCC)

Jin Woo Park; Jeong Hoon Chae; Il Hyun Park; Hyuk Joon Youn; Yang Ho Moon

doi:10.1111/j.1551-2916.2007.01688.x

Thermo-mechanical stresses and mechanical reliability of multilayer ceramic capacitors (MLCC)

Jin Woo Park, Jeong Hoon Chae, Il Hyun Park, Hyuk Joon Youn, Yang Ho Moon

Department of Materials Science and Engineering

Research output: Contribution to journal › Article

15 Citations (Scopus)

Abstract

In this work, the effects of design parameters on the mechanical reliability of multilayer ceramic capacitors (MLCC) are evaluated by a board flex test. Using the finite element method (FEM), thermo-mechanical stresses that accumulated in the ceramic of MLCC during termination firing, soldering, and board flex test are determined by varying design parameters. The calculation results revealed that the sizes of Cu terminations are the parameters that affect the stress the most. The degree of sensitivity of the stress to the dominant parameters depends significantly on the thickness ratio of the MLCC to the board. Based on our investigation, better design rules are proposed and verified experimentally.

Original language	English
Pages (from-to)	2151-2158
Number of pages	8
Journal	Journal of the American Ceramic Society
Volume	90
Issue number	7
DOIs	https://doi.org/10.1111/j.1551-2916.2007.01688.x
Publication status	Published - 2007 Jul 1

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All Science Journal Classification (ASJC) codes

Ceramics and Composites
Materials Chemistry

Cite this

Park, J. W., Chae, J. H., Park, I. H., Youn, H. J., & Moon, Y. H. (2007). Thermo-mechanical stresses and mechanical reliability of multilayer ceramic capacitors (MLCC). Journal of the American Ceramic Society, 90(7), 2151-2158. https://doi.org/10.1111/j.1551-2916.2007.01688.x

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10.1111/j.1551-2916.2007.01688.x