Thermo-mechanical stresses and mechanical reliability of multilayer ceramic capacitors (MLCC)

jin woo Park, Jeong Hoon Chae, Il Hyun Park, Hyuk Joon Youn, Yang Ho Moon

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

In this work, the effects of design parameters on the mechanical reliability of multilayer ceramic capacitors (MLCC) are evaluated by a board flex test. Using the finite element method (FEM), thermo-mechanical stresses that accumulated in the ceramic of MLCC during termination firing, soldering, and board flex test are determined by varying design parameters. The calculation results revealed that the sizes of Cu terminations are the parameters that affect the stress the most. The degree of sensitivity of the stress to the dominant parameters depends significantly on the thickness ratio of the MLCC to the board. Based on our investigation, better design rules are proposed and verified experimentally.

Original languageEnglish
Pages (from-to)2151-2158
Number of pages8
JournalJournal of the American Ceramic Society
Volume90
Issue number7
DOIs
Publication statusPublished - 2007 Jul 1

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Ceramic capacitors
Multilayers
Soldering
Finite element method

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Park, jin woo ; Chae, Jeong Hoon ; Park, Il Hyun ; Youn, Hyuk Joon ; Moon, Yang Ho. / Thermo-mechanical stresses and mechanical reliability of multilayer ceramic capacitors (MLCC). In: Journal of the American Ceramic Society. 2007 ; Vol. 90, No. 7. pp. 2151-2158.
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Thermo-mechanical stresses and mechanical reliability of multilayer ceramic capacitors (MLCC). / Park, jin woo; Chae, Jeong Hoon; Park, Il Hyun; Youn, Hyuk Joon; Moon, Yang Ho.

In: Journal of the American Ceramic Society, Vol. 90, No. 7, 01.07.2007, p. 2151-2158.

Research output: Contribution to journalArticle

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