Thickness uniformity inspection with comparison off-axis digital holography

Jinan Jin, Sungbin Jeon, Janghyun Cho, No Cheol Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This research proposes a comparison off-axis digital holographic technology for thickness uniformity inspection of transparent products. Compared to existing technologies, the comparison off-axis digital holographic method has advantages such as high depth resolution and large field of view. Also, the proposed method can measure the thickness differences between standard product and the ones produced by one shot imaging with tilt correction. Comparative analysis is used to demonstrate the effectiveness.

Original languageEnglish
Title of host publicationASME 2016 Conference on Information Storage and Processing Systems, ISPS 2016
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791849880
DOIs
Publication statusPublished - 2016
EventASME 2016 Conference on Information Storage and Processing Systems, ISPS 2016 - Santa Clara, United States
Duration: 2016 Jun 202016 Jun 21

Publication series

NameASME 2016 Conference on Information Storage and Processing Systems, ISPS 2016

Other

OtherASME 2016 Conference on Information Storage and Processing Systems, ISPS 2016
CountryUnited States
CitySanta Clara
Period16/6/2016/6/21

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Hardware and Architecture
  • Information Systems

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  • Cite this

    Jin, J., Jeon, S., Cho, J., & Park, N. C. (2016). Thickness uniformity inspection with comparison off-axis digital holography. In ASME 2016 Conference on Information Storage and Processing Systems, ISPS 2016 (ASME 2016 Conference on Information Storage and Processing Systems, ISPS 2016). American Society of Mechanical Engineers. https://doi.org/10.1115/ISPS2016-9544