Thin film receiver materials for deterministic assembly by transfer printing

Tae Il Kim, Mo Joon Kim, Yei Hwan Jung, Hyejin Jang, Canan Dagdeviren, Hsuan An Pao, Sang June Cho, Andrew Carlson, Ki Jun Yu, Abid Ameen, Hyun Joong Chung, Sung Hun Jin, Zhenqiang Ma, John A. Rogers

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.

Original languageEnglish
Pages (from-to)3502-3507
Number of pages6
JournalChemistry of Materials
Volume26
Issue number11
DOIs
Publication statusPublished - 2014 Jun 10

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Chemical Engineering(all)
  • Materials Chemistry

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  • Cite this

    Kim, T. I., Kim, M. J., Jung, Y. H., Jang, H., Dagdeviren, C., Pao, H. A., Cho, S. J., Carlson, A., Yu, K. J., Ameen, A., Chung, H. J., Jin, S. H., Ma, Z., & Rogers, J. A. (2014). Thin film receiver materials for deterministic assembly by transfer printing. Chemistry of Materials, 26(11), 3502-3507. https://doi.org/10.1021/cm501002b