Transient and Crosstalk Analysis of Slightly Lossy Interconnection Lines for Wafer Scale Integration and Wafer Scale Hybrid Packaging—Weak Coupling Case

Jaeseok Kim, John F. Mcdonald

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Tbis paper investigates the transmission characteristics of wafer scale interconnection Hues which are Modeled here by weakly coupled lossy transmission Unes. Laplace transform techniques and numerical methods are used to solve the coupled transmissionline equations in the weak coupling approximation. We obtain transient responses and crosstalk noise waveforms in the time domain. The modification of the coupling resulting from the losses is examined. Our analysis indicates that while there is some increase in coupling resulting from the losses, the rise-time dependent part of this coupling (which is a more severe component at high frequencies) is still suppressed for homogeneous dielectrics as is the case for lossless lines. However, other results seen in terminated lossless lines such as the absence of any coupling at the far end are degraded by the losses. A guide for determining the design parameters of the interconnections is presented along with some experimental results measured with actual fabricated wafer scale test structures.

Original languageEnglish
Pages (from-to)1369-1382
Number of pages14
JournalIEEE Transactions on Circuits and Systems
Volume35
Issue number11
DOIs
Publication statusPublished - 1988 Nov

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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