TSV repair architecture for clustered faults

Jaewon Jang, Minho Cheong, Sungho Kang

Research output: Contribution to journalArticle

Abstract

The poor quality of the die stacking process for 3-D integrated circuits can result in the failure of the process in the through-silicon-vias (TSVs) in dense regions. Previous works use the same number of redundant TSVs and architectures that do not consider the TSV density. A repair architecture and an appropriate number of redundant TSVs, which are chosen considering the TSV density, are required for an improved repair rate. This paper proposes a method that demonstrates such an architecture and calculates the required number of TSVs. The method has a high repair rate for clustered faults, and wire-length problems are solved using the shift-based repair method.

Original languageEnglish
Article number8299466
Pages (from-to)190-194
Number of pages5
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume38
Issue number1
DOIs
Publication statusPublished - 2019 Jan

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Repair
Silicon
Integrated circuits
Wire

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

Cite this

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TSV repair architecture for clustered faults. / Jang, Jaewon; Cheong, Minho; Kang, Sungho.

In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 38, No. 1, 8299466, 01.2019, p. 190-194.

Research output: Contribution to journalArticle

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