Tuning the morphology of copper nanowires by controlling the growth processes in electrodeposition

Sangwoo Shin, Beom Seok Kim, Kyung Min Kim, Bo Hyun Kong, Hyung Koun Cho, Hyung Hee Cho

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

We present an alternative route to fabricate Cu nanowires having various classes of morphologies by controlling the deposition temperature. A rough nanowire with an irregular wire diameter along the wire axis is obtained at a high deposition temperature, whereas a smooth, compact nanowire is obtained as the temperature is lowered. However, as the temperature is dropped further down to subzero degrees, an unusual behavior is observed where the nanowires exhibit rough, dendritic morphologies with relatively uniform wire diameters. We explain this peculiar growth behavior on the basis of kinetic and thermodynamic growth processes.

Original languageEnglish
Pages (from-to)17967-17971
Number of pages5
JournalJournal of Materials Chemistry
Volume21
Issue number44
DOIs
Publication statusPublished - 2011 Nov 28

Fingerprint

Electrodeposition
Nanowires
Copper
Tuning
Wire
Temperature
Thermodynamics
Kinetics

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Chemistry

Cite this

Shin, Sangwoo ; Kim, Beom Seok ; Kim, Kyung Min ; Kong, Bo Hyun ; Cho, Hyung Koun ; Cho, Hyung Hee. / Tuning the morphology of copper nanowires by controlling the growth processes in electrodeposition. In: Journal of Materials Chemistry. 2011 ; Vol. 21, No. 44. pp. 17967-17971.
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Tuning the morphology of copper nanowires by controlling the growth processes in electrodeposition. / Shin, Sangwoo; Kim, Beom Seok; Kim, Kyung Min; Kong, Bo Hyun; Cho, Hyung Koun; Cho, Hyung Hee.

In: Journal of Materials Chemistry, Vol. 21, No. 44, 28.11.2011, p. 17967-17971.

Research output: Contribution to journalArticle

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