Tyrosine-Rich Peptide Insulator for Rapidly Dissolving Transient Electronics

Seok Daniel Namgung, Min Kyu Song, Taehoon Sung, Ouk Hyun Cho, Misong Ju, Hyeohn Kim, Yoon Sik Lee, Ki Tae Nam, Jang Yeon Kwon

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

Transient electronics is a good platform for human implantable biomedical devices for diagnosing diseases and delivering therapeutic materials because additional surgery is not required to retrieve the device. Surrounding bio-fluids inevitably dissolve device components, and the remaining electronic debris can trigger hazardous inflammation reactions within human body. Therefore, it is important to reduce the total dissolution time of devices even after they stop working. Thus, fast-dissolving tyrosine-based peptides are suggested as an insulator instead of SiO2, which has been used as a dissolution retarder in transient electronics. By combining a peptide insulator, zinc oxide semiconductor, and tungsten conductor, a biocompatible and biodegradable thin film transistor is fabricated. The device exhibits moderate performance (ON/OFF >103 and field-effect mobility of ≈0.6 cm2 V−1 s−1) and is fast-dissolving (<3 h) in bio-fluids.

Original languageEnglish
Article number2000516
JournalAdvanced Materials Technologies
Volume5
Issue number9
DOIs
Publication statusPublished - 2020 Sep 1

Bibliographical note

Funding Information:
This work was supported by Samsung Research Funding Center of Samsung Electronics under Project Number SRFC‐MA1401‐51. The result on chitosan substrate was supported by Prof. Jae‐Woon Nah in Sunchon National University.

Publisher Copyright:
© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Industrial and Manufacturing Engineering

Fingerprint

Dive into the research topics of 'Tyrosine-Rich Peptide Insulator for Rapidly Dissolving Transient Electronics'. Together they form a unique fingerprint.

Cite this