Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging

Jongbaeg Kim, Mu Chiao, Liwei Lin

Research output: Contribution to journalArticlepeer-review

33 Citations (Scopus)

Fingerprint Dive into the research topics of 'Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging'. Together they form a unique fingerprint.

Engineering & Materials Science