Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long-Lived Bioimplants

Jinghua Li, Rui Li, Chia Han Chiang, Yishan Zhong, Haixu Shen, Enming Song, Mackenna Hill, Sang Min Won, Ki Jun Yu, Janice Mihyun Baek, Yujin Lee, Jonathan Viventi, Yonggang Huang, John A. Rogers

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