Uplink MU-based channel access scheme for high-throughput of multiple users

Eunbi Ku, Chulho Chung, Byungcheol Kang, Jaeseok Kim

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A new channel access scheme to improve the throughput in the medium access control layer is proposed to support the high data rate of multiple users. The proposed scheme is based on access point-coordinated multiuser transmission via the adoption of a trigger frame. The total throughput of the proposed scheme is improved by up to 30% compared with the uplink-multiuser channel access scheme based on the request to send/clear to send exchange. Moreover, as the number of stations increases, the degree of improvement in performance increases.

Original languageEnglish
Pages (from-to)691-693
Number of pages3
JournalElectronics Letters
Volume53
Issue number10
DOIs
Publication statusPublished - 2017 Jan 1

Fingerprint

Throughput
Medium access control

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Ku, Eunbi ; Chung, Chulho ; Kang, Byungcheol ; Kim, Jaeseok. / Uplink MU-based channel access scheme for high-throughput of multiple users. In: Electronics Letters. 2017 ; Vol. 53, No. 10. pp. 691-693.
@article{ef50408c0d984dae8564f1874db0b34c,
title = "Uplink MU-based channel access scheme for high-throughput of multiple users",
abstract = "A new channel access scheme to improve the throughput in the medium access control layer is proposed to support the high data rate of multiple users. The proposed scheme is based on access point-coordinated multiuser transmission via the adoption of a trigger frame. The total throughput of the proposed scheme is improved by up to 30{\%} compared with the uplink-multiuser channel access scheme based on the request to send/clear to send exchange. Moreover, as the number of stations increases, the degree of improvement in performance increases.",
author = "Eunbi Ku and Chulho Chung and Byungcheol Kang and Jaeseok Kim",
year = "2017",
month = "1",
day = "1",
doi = "10.1049/el.2017.0346",
language = "English",
volume = "53",
pages = "691--693",
journal = "Electronics Letters",
issn = "0013-5194",
publisher = "Institution of Engineering and Technology",
number = "10",

}

Uplink MU-based channel access scheme for high-throughput of multiple users. / Ku, Eunbi; Chung, Chulho; Kang, Byungcheol; Kim, Jaeseok.

In: Electronics Letters, Vol. 53, No. 10, 01.01.2017, p. 691-693.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Uplink MU-based channel access scheme for high-throughput of multiple users

AU - Ku, Eunbi

AU - Chung, Chulho

AU - Kang, Byungcheol

AU - Kim, Jaeseok

PY - 2017/1/1

Y1 - 2017/1/1

N2 - A new channel access scheme to improve the throughput in the medium access control layer is proposed to support the high data rate of multiple users. The proposed scheme is based on access point-coordinated multiuser transmission via the adoption of a trigger frame. The total throughput of the proposed scheme is improved by up to 30% compared with the uplink-multiuser channel access scheme based on the request to send/clear to send exchange. Moreover, as the number of stations increases, the degree of improvement in performance increases.

AB - A new channel access scheme to improve the throughput in the medium access control layer is proposed to support the high data rate of multiple users. The proposed scheme is based on access point-coordinated multiuser transmission via the adoption of a trigger frame. The total throughput of the proposed scheme is improved by up to 30% compared with the uplink-multiuser channel access scheme based on the request to send/clear to send exchange. Moreover, as the number of stations increases, the degree of improvement in performance increases.

UR - http://www.scopus.com/inward/record.url?scp=85019210527&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85019210527&partnerID=8YFLogxK

U2 - 10.1049/el.2017.0346

DO - 10.1049/el.2017.0346

M3 - Article

AN - SCOPUS:85019210527

VL - 53

SP - 691

EP - 693

JO - Electronics Letters

JF - Electronics Letters

SN - 0013-5194

IS - 10

ER -