W-band low-loss wafer-scale package for RF MEMS

Byung-Wook Min, Gabriel M. Rebeiz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper reports on the design and fabrication of a wafer-scale package for RF MEMS devices at W-band. Coplanar waveguide (CPW) lines on a high resistivity silicon wafer are covered with another silicon wafer using gold-to-gold thermo-compression bonding. Oxide is used as a dielectric interlayer for CPW feedthroughs underneath the gold sealing ring. A 130 μm high cavity is etched in the cap wafer to remove an impact of capping wafer on CPW lines or RF MEMS components. The designed feedthrough has an insertion loss of 0.19-0.26 dB at 75-110 GHz with a return loss of < -20 dB (per transition). The gold sealing ring is connected to the CPW ground to eliminate any parasitic ring effect of the gold sealing ring. The whole package has a measured insertion loss of 0.6-0.8 dB and return loss of < -20 dB at 75-110 GHz.

Original languageEnglish
Title of host publication35th European Microwave Conference 2005 - Conference Proceedings
Pages1535-1538
Number of pages4
DOIs
Publication statusPublished - 2005 Dec 1
Event2005 European Microwave Conference - Paris, France
Duration: 2005 Oct 42005 Oct 6

Publication series

Name35th European Microwave Conference 2005 - Conference Proceedings
Volume3

Other

Other2005 European Microwave Conference
CountryFrance
CityParis
Period05/10/405/10/6

Fingerprint

Coplanar waveguides
MEMS
Gold
Telephone lines
Insertion losses
Silicon wafers
Antenna grounds
Compaction
Fabrication
Oxides

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Min, B-W., & Rebeiz, G. M. (2005). W-band low-loss wafer-scale package for RF MEMS. In 35th European Microwave Conference 2005 - Conference Proceedings (pp. 1535-1538). [1610244] (35th European Microwave Conference 2005 - Conference Proceedings; Vol. 3). https://doi.org/10.1109/EUMC.2005.1610244
Min, Byung-Wook ; Rebeiz, Gabriel M. / W-band low-loss wafer-scale package for RF MEMS. 35th European Microwave Conference 2005 - Conference Proceedings. 2005. pp. 1535-1538 (35th European Microwave Conference 2005 - Conference Proceedings).
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Min, B-W & Rebeiz, GM 2005, W-band low-loss wafer-scale package for RF MEMS. in 35th European Microwave Conference 2005 - Conference Proceedings., 1610244, 35th European Microwave Conference 2005 - Conference Proceedings, vol. 3, pp. 1535-1538, 2005 European Microwave Conference, Paris, France, 05/10/4. https://doi.org/10.1109/EUMC.2005.1610244

W-band low-loss wafer-scale package for RF MEMS. / Min, Byung-Wook; Rebeiz, Gabriel M.

35th European Microwave Conference 2005 - Conference Proceedings. 2005. p. 1535-1538 1610244 (35th European Microwave Conference 2005 - Conference Proceedings; Vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Min B-W, Rebeiz GM. W-band low-loss wafer-scale package for RF MEMS. In 35th European Microwave Conference 2005 - Conference Proceedings. 2005. p. 1535-1538. 1610244. (35th European Microwave Conference 2005 - Conference Proceedings). https://doi.org/10.1109/EUMC.2005.1610244