W-band micromachined vertical interconnection for three-dimensional microwave ICs

Katherine J. Henick, Jong Gwan Yook, Stephen V. Robertson, Gabriel M. Rebeiz, Linda P.B. Katehi

Research output: Contribution to conferencePaper

13 Citations (Scopus)

Abstract

A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 ¿m width and 520 ¿m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.

Original languageEnglish
Pages402-406
Number of pages5
DOIs
Publication statusPublished - 1999
Event1999 29th European Microwave Conference, EuMC 1999 - Munich, Germany
Duration: 1999 Oct 51999 Oct 7

Other

Other1999 29th European Microwave Conference, EuMC 1999
CountryGermany
CityMunich
Period99/10/599/10/7

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Henick, K. J., Yook, J. G., Robertson, S. V., Rebeiz, G. M., & Katehi, L. P. B. (1999). W-band micromachined vertical interconnection for three-dimensional microwave ICs. 402-406. Paper presented at 1999 29th European Microwave Conference, EuMC 1999, Munich, Germany. https://doi.org/10.1109/EUMA.1999.338477