Wafer-level transfer of thermo-piezoelectric Si3N4 cantilever array on a CMOS circuit for high density probe-based data storage

Young Sik Kim, Hyo Jin Nam, Seong Soo Jang, Caroline Sunyong Lee, Won Hyeog Jin, Il Joo Cho, Jong Uk Bu, Sun Il Chang, Euisik Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

In this research, a wafer-level transfer method of cantilever array on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride (Si3N 4) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric SisN4 cantilevers. The thermo-piezoelectric Si3N4 cantilever arrays were fabricated with a conventional p-type silicon wafer instead of a SOI wafer. Furthermore, we have developed a wafer-level cantilever transfer process, which requires only one step of cantilever transfer process to integrate the CMOS circuit with the cantilevers. Using this process, we have fabricated a single thermo-piezoelectric Si3N4 cantilever, and recorded 65nm data bits on a PMMA film. And we have successfully applied this method to transfer 34×34 thermo-piezoelectric Si3N4 cantilever arrays on a CMOS wafer. Finally, We obtained reading signals from one of the cantilevers.

Original languageEnglish
Title of host publication19th IEEE International Conference on Micro Electro Mechanical Systems
Pages922-925
Number of pages4
Publication statusPublished - 2006 Oct 24
Event19th IEEE International Conference on Micro Electro Mechanical Systems - Istanbul, Turkey
Duration: 2006 Jan 222006 Jan 26

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2006
ISSN (Print)1084-6999

Other

Other19th IEEE International Conference on Micro Electro Mechanical Systems
CountryTurkey
CityIstanbul
Period06/1/2206/1/26

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Kim, Y. S., Nam, H. J., Jang, S. S., Lee, C. S., Jin, W. H., Cho, I. J., Bu, J. U., Chang, S. I., & Yoon, E. (2006). Wafer-level transfer of thermo-piezoelectric Si3N4 cantilever array on a CMOS circuit for high density probe-based data storage. In 19th IEEE International Conference on Micro Electro Mechanical Systems (pp. 922-925). [1627951] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2006).