Wafer-scale, conformal and direct growth of MoS 2 thin films by atomic layer deposition

Yujin Jang, Seungmin Yeo, Han Bo Ram Lee, Hyungjun Kim, Soo Hyun Kim

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59 Citations (Scopus)


Molybdenum disulfide (MoS 2 ) thin films were grown directly on SiO 2 covered wafers by atomic layer deposition (ALD) at the deposition temperatures ranging from 175 to 225 °C using molybdenum hexacarbonyl [Mo(CO) 6 ] and H 2 S plasma as the precursor and reactant, respectively. Self-limited film growth on the thermally-grown SiO 2 substrate was observed with both the precursor and reactant pulsing time. The growth rate was ∼0.05 nm/cycle and a short incubation cycle of around 13 was observed at a deposition temperature of 175 °C. The MoS 2 films formed nanocrystalline microstructure with a hexagonal crystal system (2H-MoS 2 ), which was confirmed by X-ray diffraction and transmission electron microscopy. Single crystal MoS 2 nanosheets, ∼20 nm in size, were fabricated by controlling the number of ALD cycles. The ALD-MoS 2 thin films exhibited good stoichiometry with negligible C impurities, approximately 0.1 at.% from Rutherford backscattering spectrometry (RBS). X-ray photoelectron spectroscopy confirmed the formation of chemical bonding from MoS 2 . The step coverage of ALD-MoS 2 was approximately 75% at a 100 nm sized trench. Overall, the ALD-MoS 2 process made uniform deposition possible on the wafer-scale (4 in. in diameter).

Original languageEnglish
Pages (from-to)160-165
Number of pages6
JournalApplied Surface Science
Publication statusPublished - 2016 Mar 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Physics and Astronomy(all)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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