Wireless power transmission for implantable devices using inductive component of closed-magnetic circuit structure

Kihyun Jung, Yong Ho Kim, Jung Choi Euy, Jun Kim Hyun, Yong Jun Kim

Research output: Contribution to conferencePaper

12 Citations (Scopus)

Abstract

An integrated flexible inductor is realized for wireless transcutaneous power transmission to implantable devices. Our method uses a mechanically flexible inductor which can be less invasively implanted in, or more easily attached to, the human body. The inductor pair is used for wireless power transmission. The primary inductor is attached on the patient's skin and the secondary inductor is implanted under the subcutaneous tissue. The transmission efficiency depends on the induced magnetic flux on the secondary inductor. In order to achieve a closed magnetic circuit, a core material composed of 81% nickel and 19 % iron is used for concentrating a magnetic flux which is generated on the primary inductor and transmitted to the secondary inductor. Three kinds of flexible inductors were fabricated using flexible printed circuit board (FPCB) fabrication technologies. Transmission efficiency of each inductor was measured using a function generator and an oscilloscope.

Original languageEnglish
Pages272-277
Number of pages6
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI - Seoul, Korea, Republic of
Duration: 2008 Aug 202008 Aug 22

Other

Other2008 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI
CountryKorea, Republic of
CitySeoul
Period08/8/2008/8/22

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Computer Science Applications

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  • Cite this

    Jung, K., Kim, Y. H., Euy, J. C., Hyun, J. K., & Kim, Y. J. (2008). Wireless power transmission for implantable devices using inductive component of closed-magnetic circuit structure. 272-277. Paper presented at 2008 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI, Seoul, Korea, Republic of. https://doi.org/10.1109/MFI.2008.4648077