Yield Prediction Through the Event Sequence Analysis of the Die Attach Process

Hoyeop Lee, Chang Ouk Kim, Hyo Heon Ko, Min Kyoon Kim

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Die attach is the process of mounting a plurality of dice to a printed circuit board (PCB) or substrate. Die attach is critical to the thermal and electrical performance of semiconductor products, significantly affecting the final yield of PCBs. In general, the die attacher records alarm events, change events, and maintenance events in a log. Alarm events occur when dice are not aligned well to the mounting positions on a PCB. Change events are recorded when product types are changed or raw materials of different suppliers are introduced. Maintenance events are recorded whenever the workers conduct corrective actions due to alarm events. We empirically observed that different sequences of events have different effects on the final yield. In this paper, we propose a data mining approach that predicts the final yield of a PCB using the event sequences recorded in the log of the die attacher. We propose a predictive association rule considering the event sequence (PARCOS) algorithm that creates a set of rules, in which each rule estimates the yield for a sequence of events. An experiment with a work-site dataset demonstrated that the PARCOS algorithm had a yield prediction accuracy that was at least 9% higher than those of the regression models that did not consider the event sequences.

Original languageEnglish
Article number7293212
Pages (from-to)563-570
Number of pages8
JournalIEEE Transactions on Semiconductor Manufacturing
Volume28
Issue number4
DOIs
Publication statusPublished - 2015 Nov 1

Fingerprint

Printed circuit boards
Association rules
Mountings
predictions
Polychlorinated Biphenyls
Polychlorinated biphenyls
Data mining
Raw materials
warning systems
printed circuits
circuit boards
Semiconductor materials
Substrates
mounting
maintenance
Experiments
data mining
polychlorinated biphenyls
products
regression analysis

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

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Yield Prediction Through the Event Sequence Analysis of the Die Attach Process. / Lee, Hoyeop; Kim, Chang Ouk; Ko, Hyo Heon; Kim, Min Kyoon.

In: IEEE Transactions on Semiconductor Manufacturing, Vol. 28, No. 4, 7293212, 01.11.2015, p. 563-570.

Research output: Contribution to journalArticle

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